فرن إعادة لصق SMD

SEHO goreflow 1,8

Type: Reflow soldering oven for PCB assembly (convection reflow).

Manufacturer: SEHO Systems GmbH.

Model: GoReflow 1.8.

Application: Soldering process using full convection heat for small to medium-sized batches.

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Heating and Process Zones

Number of heating zones: 5 zones (via convection).

Length of heated zone: approx. 1850 mm.

Maximum PCB width: approx. 410 mm.

Number of cooling zones: 2 zones with active ventilation.

Average transport/conveyor speed: approx. 0.40 – 0.55 m/min.

Machine Structure and Dimensions

Total length: approx. 3200 mm.

Width: approx. 1250 mm.

Height: approx. 1600 mm.

Control and Functions

Operation: Touch display or microprocessor-controlled interface (depending on configuration).

Flux management: Filter and collection system for solder flux residues.

Safety features: Emergency stop button and visual status indicators (signal lamp).

Inline integration: Options for connection to SMT production lines via interfaces (optional).

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