فرن إعادة لصق SMD

Neoden IN6

General Features

Type: Desktop reflow oven (infrared + hot air convection)

Number of heating zones: 6 (top heating)

Cooling zone: 1 internal cooling zone

Control: Touchscreen with programmable profiles

Application: Prototyping, small to medium series production

PCB Specifications

Max. PCB width: ± 260 mm

Max. PCB length: ± 350 mm

Max. PCB thickness: 20 mm

Transport: Mesh conveyor (adjustable speed)

Temperature & Performance

Max. temperature: ± 300 °C

Warm-up time: ± 15–20 minutes

Temperature control: PID regulation

Temperature accuracy: ± 1 °C

Number of programmable profiles: multiple (storage possible)

Electrical Data
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Power supply: 220V (single phase)

Power: ± 1100–2000 W (depending on version)

📏 Dimensions & Weight

Dimensions (L×W×H): ± 1020 × 507 × 350 mm

Weight: ± 39 kg

Suitable For

Lead-free (RoHS) soldering

Prototyping labs

Small production environments

Universities / development departments

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