فحص ثلاثي الأبعاد ضمن الخط SPI 8030-3L

Koh-Young SPI 8030-3L

Gerber conversion software
Easy-to-use software package with touch screen operation
SPC Plus software
Measurement:
insufficient, excessive, or missing solder paste
bridging
paste deformations
volume, height
XY positions
shadow-free measurement via dual-path projections
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4 MPix high-speed camera, 20µm XY resolution, 0.37µm Z resolution
approx. 60cm²/sec inspection speed
Z-axis tracking
SPC-Plus software package
Max. PCB size: 510x510mm
automatic width adjustment
SMEMA interface
Transport height 950 +/- 50mm
QR code recognition
2D detection of bridges and smearing

تمت ترجمة الإعلان تلقائيًا. قد تحدث أخطاء في الترجمة.