جهاز تلحيم الأسلاكK&S 8020
K&S 8020
جهاز تلحيم الأسلاك
K&S 8020
K&S 8020
سنة الصنع
٢٠٠٤
الحالة
مستعمل
الموقع
Veenendaal 

بيانات عن الآلة
- اسم الماكينة:
- جهاز تلحيم الأسلاك
- الشركة المصنعة:
- K&S 8020
- طراز:
- K&S 8020
- سنة الصنع:
- ٢٠٠٤
- الحالة:
- جيد جدًا (مستعمل)
السعر والموقع
- الموقع:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland

اتصل
تفاصيل العرض
- معرّف الإعلان:
- A22123863
- تحديث:
- آخر مرة في ١٥.٠٦.٢٠٢٦
وصف
Known K&S 8020 Specifications
Specification Value
Bonding type Automatic thermosonic ball bonder
Wire material Gold wire (Au)
Bond head Voice-coil direct-drive bond head
Ultrasonic transducer 120 kHz unibody transducer with adaptive USG
Vision system 20/20 vision system
Camera Sony XC-75 CCD
Bond pitch capability Sub-70 µm pitch kit available
Bond area 2.0 × 2.3 in (≈ 50.8 × 58.4 mm)
Optics Universal optics with increased depth of field
Illumination LED
Workholder 250-series heated manual workholder
Power 208 V, 50/60 Hz
Control Software-controlled automatic bonding programs
Typical Process Capability
The 8020 was developed to provide:
Fine-pitch bonding
Long, low wire loops
Improved process control
High throughput for leadframe and laminate packages
Automated vision alignment and pattern recognition
These capabilities were key selling points of the 8000 family.
Applications
Plastic IC packages
SOIC, QFP, TSOP
Memory devices
ASICs
Hfedpfx Aozdgm Dscnsh
Hybrid microelectronics
Chip-on-board assemblies
Physical Characteristics
Unfortunately, a complete factory datasheet with dimensions, weight, XY-table resolution, bond-force range, and supported wire diameters is not readily available in public archives. Most of the available information comes from listings of used equipment and K&S annual reports.
If you need details such as:
Bond force range (grams)
Wire diameter range (e.g., 0.7–2.0 mil)
XY positioning resolution
Air requirements
Maintenance manual
Error codes or calibration procedures
تمت ترجمة الإعلان تلقائيًا. قد تحدث أخطاء في الترجمة.
Specification Value
Bonding type Automatic thermosonic ball bonder
Wire material Gold wire (Au)
Bond head Voice-coil direct-drive bond head
Ultrasonic transducer 120 kHz unibody transducer with adaptive USG
Vision system 20/20 vision system
Camera Sony XC-75 CCD
Bond pitch capability Sub-70 µm pitch kit available
Bond area 2.0 × 2.3 in (≈ 50.8 × 58.4 mm)
Optics Universal optics with increased depth of field
Illumination LED
Workholder 250-series heated manual workholder
Power 208 V, 50/60 Hz
Control Software-controlled automatic bonding programs
Typical Process Capability
The 8020 was developed to provide:
Fine-pitch bonding
Long, low wire loops
Improved process control
High throughput for leadframe and laminate packages
Automated vision alignment and pattern recognition
These capabilities were key selling points of the 8000 family.
Applications
Plastic IC packages
SOIC, QFP, TSOP
Memory devices
ASICs
Hfedpfx Aozdgm Dscnsh
Hybrid microelectronics
Chip-on-board assemblies
Physical Characteristics
Unfortunately, a complete factory datasheet with dimensions, weight, XY-table resolution, bond-force range, and supported wire diameters is not readily available in public archives. Most of the available information comes from listings of used equipment and K&S annual reports.
If you need details such as:
Bond force range (grams)
Wire diameter range (e.g., 0.7–2.0 mil)
XY positioning resolution
Air requirements
Maintenance manual
Error codes or calibration procedures
تمت ترجمة الإعلان تلقائيًا. قد تحدث أخطاء في الترجمة.
مورد
ملاحظة: سجّل مجانًا أو سجّل الدخول، للاطلاع على جميع المعلومات.
آخر تواجد على الإنترنت: البارحة
مسجل منذ: 2013
١٠ إعلانات عبر الإنترنت
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هاتف & فاكس
+31 318 2... إعلانات
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