طابعة استنسل

ERSA Versaprint S1

- Patented LIST Lina Scan technology for substrate alignment and inspection
- Simplest program creation by full-surface substrate scanning
- Processing of large substrates – 550 x 500 mm
- Detection of synthetic fiducial marks or any geometries
- Diffuse and direct camera illumination for optimal substrate recognition and alignment
- Two independent, pendulum-mounted print heads
- Programmable print head with closed-loop control
- Pneumatic squeegee clamping prevents loosening during production
- Substrate fixation via Ovar-Top and Y-clamping, secure clamping even for interwoven substrates
- Motorized transport width adjustment, programmable via software
- Transport direction freely selectable
- Flexible stencil holder for various sizes, no adapter needed; substrate support via magnetic pins and blocks
- Desktop PC with Windows operating system, 17" TFT monitor. Machine programs and SPC data can be managed over the network
- SPC data is graphically displayed to the operator and stored on the hard drive
- AOI Automated Optical Inspection
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- Integrated print post-inspection with LIST
- Very simple programming of the inspection area via substrate overview image on the monitor
- Definition of areas with different sensitivity settings
- Post-inspection of PCBs for pad print and bridging between pads
- Stencil inspection for blockage of openings
- Error display on the monitor for easy operator verification
- Automatic cleaning cycle after detected stencil blockage
- Inspection speed: 9100 mm (width: 260 mm x 35 mm/s)
- SPC data acquisition

- 2D inspection
- Print format: min.: 80 x 50 mm, max.: 460 x 460 mm
- Parallel process max.: 350 x 460 mm
- Stencil size: min.: 450 x 450 mm, max.: 737 x 737 mm
- PCB thickness: 0.5 – 6 mm
- Squeegee pressure: 260 N
- Cycle time: 11 s + print
- Setup time < 3 min
- Product changeover < 2 min
- Transport height: 810 – 965 mm
- Air supply: 5 – 6 bar
- Temperature and humidity sensor
- SMEMA inline interface
- ESD kit

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