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Datacon 2200 evo gen 3 2200 evo

Datacon 2200 EVO (Gen3)

The die bonder / multi-chip assembly machine from Datacon (Besi).

Die attach, multi-chip, and flip-chip capabilities.
Placement accuracy: ±10 µm at 3σ
Theta: ±0.15° at 3σ
Bond force: 0.5–75 N
Up to 4 working heads
Wafer handling up to 12 inches
Die attach up to approximately 7,000 UPH/module
Flip-chip up to 2,500 UPH with dipping
Heated bond head up to 450 °C
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Substrate area up to 325 × 200 mm
Weight approximately 1,300 kg

تمت ترجمة الإعلان تلقائيًا. قد تحدث أخطاء في الترجمة.