آلة تجميعassembleon
Topaz xii
آلة تجميع
assembleon
Topaz xii
سنة الصنع
٢٠٠٦
الحالة
مستعمل
(يعمل بكامل كفاءته)
الموقع
Veenendaal 

بيانات عن الآلة
- اسم الماكينة:
- آلة تجميع
- الشركة المصنعة:
- assembleon
- طراز:
- Topaz xii
- سنة الصنع:
- ٢٠٠٦
- الحالة:
- جيد (مستخدم)
- الوظائف:
- يعمل بكامل كفاءته
السعر والموقع
- الموقع:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland

اتصل
تفاصيل العرض
- معرّف الإعلان:
- A22390912
- تحديث:
- آخر مرة في 22.07.2026
وصف
Specifications (See Details above for installed options)
*Assembleon Philips Topaz Rated CPH
Optimal placement rate: 14,000 cph Simultaneous pick
Nominal placement rate: 9,000 - 11,000 cph
*Applicable Components:
0402 - SOP, SOJ, PLCC 25 mm (1.0") with Line Sensor Camera
QFP 21 mm with pin pitch down to 0.65 mm (25 mil) Line sensor camera system
QFP 32 mm (1.26") with pin pitch down to 0.5 mm (20 mil) Optional area CCD camera system
*Max. component height: 6.5 mm
*Philips Topaz Mounting accuracy:
(x,y) 3s
0.08 mm for chips and SOIC Line sensor camera system
0.06 mm for QFPs Using Precision Head and optional Area CCD camera system
*Mounting angle: 0 up to ± 180 (steps of 0.01)
*Alignment system: Line sensor camera with front lighting system for Vision-on-the-Fly image processing by VICS 2500 proprietary vision system
-Second Line sensor camera for rear side is optional
-Area CCD camera for fine pitch components Optional
-Area CCD camera for fiducial alignment Standard
*Type of nozzles: Type 31
Type 31-1 (Precision Head only, spring loaded)
Type 32-2
Type 33
Type 34
Type MELF
-The nozzle types for Topaz and Emerald are the same.
*Nozzle exchange station:
12 nozzle positions Optional (No nozzles included)
*Number of heads:
One single beam with 8 exchangeable nozzles Including one Precision Head
*Placement heads actuation method:
Pneumatic or servo controlled for component height compensation
*Number of Tape Feeders:
8 mm: 100 positions
12 mm: 48 positions
16 mm: 48 positions
24 mm: 32 positions
32 mm: 32 positions
44 mm: 24 positions
56 mm: 18 positions
Stick feeders: Depends on stick dimensions
Bulk feeders: 100 x 8 mm positions
General Specifications
*Component Packaging:
Tape according to IEC/EIA-J/JEDEC: 8-56 mm Tape reel diameter max: 380mm (15")
*Manual Tray feeder:
Max. tray size 320 mm x 320 mm (12.6" x 12.6")
Optional: Manual tray feeder
*Fixed Manual Tray Feeder:
Max. tray size 635 mm x 136 mm (25" x 5.3")
Optional: Fixed manual tray
feeder (Max. board size 250 mm (10")
-Optional 558 mm x 508 mm (22" x 20").
*PCB Thickness:
Min. 0.6 mm (0.02")
Max. 3.0 mm (0.12")
*Non-mountable area:
-Board Top side:
3 mm from rear side board edge (0.12")
0 mm from front side board edge
3 mm around reference holes (0.12") (for locating pins)
Component height restrictions apply in the 10 mm (0.4") area from front side edge depending on board thickness
-Board bottom side:
5 mm from front and rear side board edge (0.2")
For Ceramic boards (optional) the non-mountable area can be different
*PCB Material:
Phenolic/FR4/Composite Materials Ceramic boards require special conveyor sections (optional)
*PCB Positioning: Locate pin fixation Adjustable
Push up pins Adjustable
Edge clamping Adjustable
Sub stop (PCB waiting buffer) Adjustable
*PCB Transport height:
900 mm ± 10 mm (35.4" ± 0.4") Standard
SMEMA 953 mm ± 12.5 mm (37.5" ± 0.5") Standard
*PCB Ratio width/length: Max. 1:3
*Philips Topaz Machine dimensions and weight:
Length: 1655 mm (5.4 ft)
Bodpoznmfajfx Ab Ssdf
Height: 1865 mm (6.1 ft)
Width: 1358 mm (4.5 ft) Width including feeders 2194mm (7.2 ft)
Weight: 1150 kg (2535 Lbs)
تمت ترجمة الإعلان تلقائيًا. قد تحدث أخطاء في الترجمة.
*Assembleon Philips Topaz Rated CPH
Optimal placement rate: 14,000 cph Simultaneous pick
Nominal placement rate: 9,000 - 11,000 cph
*Applicable Components:
0402 - SOP, SOJ, PLCC 25 mm (1.0") with Line Sensor Camera
QFP 21 mm with pin pitch down to 0.65 mm (25 mil) Line sensor camera system
QFP 32 mm (1.26") with pin pitch down to 0.5 mm (20 mil) Optional area CCD camera system
*Max. component height: 6.5 mm
*Philips Topaz Mounting accuracy:
(x,y) 3s
0.08 mm for chips and SOIC Line sensor camera system
0.06 mm for QFPs Using Precision Head and optional Area CCD camera system
*Mounting angle: 0 up to ± 180 (steps of 0.01)
*Alignment system: Line sensor camera with front lighting system for Vision-on-the-Fly image processing by VICS 2500 proprietary vision system
-Second Line sensor camera for rear side is optional
-Area CCD camera for fine pitch components Optional
-Area CCD camera for fiducial alignment Standard
*Type of nozzles: Type 31
Type 31-1 (Precision Head only, spring loaded)
Type 32-2
Type 33
Type 34
Type MELF
-The nozzle types for Topaz and Emerald are the same.
*Nozzle exchange station:
12 nozzle positions Optional (No nozzles included)
*Number of heads:
One single beam with 8 exchangeable nozzles Including one Precision Head
*Placement heads actuation method:
Pneumatic or servo controlled for component height compensation
*Number of Tape Feeders:
8 mm: 100 positions
12 mm: 48 positions
16 mm: 48 positions
24 mm: 32 positions
32 mm: 32 positions
44 mm: 24 positions
56 mm: 18 positions
Stick feeders: Depends on stick dimensions
Bulk feeders: 100 x 8 mm positions
General Specifications
*Component Packaging:
Tape according to IEC/EIA-J/JEDEC: 8-56 mm Tape reel diameter max: 380mm (15")
*Manual Tray feeder:
Max. tray size 320 mm x 320 mm (12.6" x 12.6")
Optional: Manual tray feeder
*Fixed Manual Tray Feeder:
Max. tray size 635 mm x 136 mm (25" x 5.3")
Optional: Fixed manual tray
feeder (Max. board size 250 mm (10")
-Optional 558 mm x 508 mm (22" x 20").
*PCB Thickness:
Min. 0.6 mm (0.02")
Max. 3.0 mm (0.12")
*Non-mountable area:
-Board Top side:
3 mm from rear side board edge (0.12")
0 mm from front side board edge
3 mm around reference holes (0.12") (for locating pins)
Component height restrictions apply in the 10 mm (0.4") area from front side edge depending on board thickness
-Board bottom side:
5 mm from front and rear side board edge (0.2")
For Ceramic boards (optional) the non-mountable area can be different
*PCB Material:
Phenolic/FR4/Composite Materials Ceramic boards require special conveyor sections (optional)
*PCB Positioning: Locate pin fixation Adjustable
Push up pins Adjustable
Edge clamping Adjustable
Sub stop (PCB waiting buffer) Adjustable
*PCB Transport height:
900 mm ± 10 mm (35.4" ± 0.4") Standard
SMEMA 953 mm ± 12.5 mm (37.5" ± 0.5") Standard
*PCB Ratio width/length: Max. 1:3
*Philips Topaz Machine dimensions and weight:
Length: 1655 mm (5.4 ft)
Bodpoznmfajfx Ab Ssdf
Height: 1865 mm (6.1 ft)
Width: 1358 mm (4.5 ft) Width including feeders 2194mm (7.2 ft)
Weight: 1150 kg (2535 Lbs)
تمت ترجمة الإعلان تلقائيًا. قد تحدث أخطاء في الترجمة.
مورد
ملاحظة: سجّل مجانًا أو سجّل الدخول، للاطلاع على جميع المعلومات.
مسجل منذ: 2013
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